SM8S33A Datasheet | Galaxy Microelectronics

FEATURES z Ideally suited for load dump protection z Plastic package has Underwriters Laboratory Flammability Classification 94V-0 z High temperature stability due to unique oxide passivation and patented PAR® construction z Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation z Low leakage current at TJ = 175°C z High temperature soldering guaranteed:260°C for 10 seconds at terminals z Meets ISO7637-2 surge spec. z Low forward voltage drop MECHANICAL DATA z Case: Molded plastic body, surface mount with heatsink integrally mounted in the encapsulation z Terminals: Plated, solderable per MIL-STD-750, Method 2026 z Polarity: Heatsink is anode z Mounting Position: Any Maximum Ratings and Thermal Characteristics (TA=25℃ unless otherwise noted) Characteristic Symbol Value Peak pulse power dissipation with 10/1000μs waveform 10/10,000μs...