SMAJ188 Overview
Key Features
- Optimized for LAN protection applications
- Low profile package with built-in strain relief for surface mounted applications
- Very fast response time
- High temperature soldering guaranteed: 260℃/ 10 seconds at terminals MECHANICAL DATA
- Case: JEDEC DO-214AC molded plastic over passivated chip
- Terminals: solder plated, solderable per MIL-STD-750, method 2026
- Mounting position: any Weight: 0.002 ounces, 0.064 grams Devices for Bidirectional Applications For bi-directional devices
