SMBJ70A Datasheet | Galaxy Microelectronics

Features - Low profile package with built-in strain relief for SMT applications - Low incremental surge resistance, excellent clamping capability - 600W peak pulse power capability with very fast response time - High temperature soldering guaranteed: 260°C / 10s at terminals - Uni-directional applications - Ro HS pliant with Halogen-free Mechanical Data - Case: SMB molded plastic - Molding pound: UL flammability classification rating 94V-0 - Terminals: Solder plated; solderable per MIL- STD-202, Method 208 Maximum Ratings (@TA = 25°C unless otherwise specified) Parameter Symbol Value Peak power dissipation with a 10/1000μs waveform - 1 (FIG.1) Peak pulse current with a 10/1000μs waveform - 1 PPPM IPP 600 see E. Characteristics Typical Thermal Resistance - 2 RθJA RθJC RθJL Operating junction and storage temperature range TJ, TSTG -55 ~ +150 Note - 1: Non-repetitive current pulses, per Fig. 3 and derated above TA = 25°C Note - 2: Device mounted on p.c.b. with 10 mm x 20 mm x 0.1 mm copper pad area Unit W A °C/W °C TVP0044A .gmesemi....