US1J Datasheet PDF

FEATURES

z For surface mount applications Pb z Low profile package z Easy pick and place Lead-free z Ultrafast recovery times for high efficiency z Low forward voltage，low power loss z Built-in strain relief，ideal for automated placement z High temperature soldering:260℃/10 seconds on terminals z Plastic package has underwriters laboratories flammability classification 94V-0

MECHANICAL DATA

z Case: JEDEC DO-214AC,molded plastic body over passivated chip z Terminals: Solder Plated, solderable per MIL-STD-750,Method 2026 z Weight: 0.002 ounces, 0.064 gram

MAXIMUM RATINGS

(@TA = 25°C unless otherwise specified) Characteristic Symbol US1A US1B US1D US1G Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=110℃ Peak forward surge current 8.3ms single half sine-wave superimposed on rated load(JEDEC Method) Thermal Characte