1N5393G Datasheet | Good-Ark Semiconductor

Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 High temperature metallurgically bonded construction Glass passivated cavity-free junction Capable of meeting environmental standards of MIL-S-19500 1.5 ampere operation at TA=70 with no thermal runaway Typical IR less than 0.1 A High temperature soldering guaranteed: 350 /10 seconds, 0.375” (9.5mm) lead length, 5 lbs. (2.3kg) tension Mechanical Data Case: DO-15 molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.014 ounce, 0.395 gram DIM A B C D inches Min. 0.228 0.102 0.028 1.000 DIM ENSIONS mm Max. 0.299 0.142 0.034 Min. 5.8 2.6 0.71 25.40 Max. 7.6 3.6 0.86 Note Maximum Ratings and Electrical Characteristics Ratings at 25 ambient temperature unless otherwise specified. Symbols 1N53 91G 1N53 92G 1N53 93G 1N53 94G 1N53 95G 1N53 96G 1N53 97G 1N53 98G 1N53 99G Units Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=70 Peak forward surge current 8.3m S single half sine-wave superimposed on rated load (MIL-STD-750D 4066 method) Maximum instantaneous forward voltage at 1.5A, TA=70 Maximum DC reverse current at rated DC blocking voltage TA=25 TA=150 VRRM VRMS VDC I(AV) IFSM VF IR Trr CJ R 50 35 50 100 70 100 200 140 200 300 210 300 400 280 400 1.5 50.0 1.4 5.0 300.0 2.0 15.0 45.0 -65 to +175 500 350 500 600 420 600 800 560 800 1000 700 1000 Volts Volts Volts Amps Amps Volts A S F /W Typical reverse recovery time (Note 1) Typical junction capacitance (Note 2) Typical thermal resistance (Note 3) Operating junction and storage temperature range TJ, TSTG Notes: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0MHz and applied reverse voltage of 4.0 volts (3) Thermal resistance from junction...