3.0SMCJ13
Overview
- 3000 W peak pulse power capability with a 10/1000 µs waveform
- Excellent clamping capability
- Fast response time
- Low incremental surge resistance
- Meets MSL level 1, per J-STD-020, LF maximum Solder dip 275°C, 10s
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
