FP5ZC22 Datasheet | Good-Ark Semiconductor

Features - Toal power dissipation:max,500m W - Low leakage current - Moisture sensitivity: level 1, per J-STD-020 - Solder dip 260 °C, 10 s - Low profile， typical thickness 1.0mm - For use in stabilizing and clipping circuits with high power rating e SGA (SOD‐123FL) Maximum Ratings and Thermal Characteristics (TA = 25 °C unless otherwise noted) Parameter Symbol Value Unit Zener current See Next Table Power dissipation Ptot 500 m W Maximum instantaneous forward voltage at 200m A Thermal resistance junction to ambient air Operating junction and storage temperature range VF Rthja TJ, TSTG 1.2 90 -65 to +175 V ℃/W ℃ Note:1),The thermal resistance from junction to ambient,case or mount,mounted on P.C.B with 5×5mm copper pads,2 OZ,FR4 PCB Electrical Characteristics (TA = 25 °C unless otherwise noted) Part Marking Number Code Zener voltage VZ /V Test Dynamic current resistance IZT ZZK IZK Reverse current IR(Max) Reverse Temp voltage Coefficient of zener VR voltage,TKvz Vz(MIN) Vz(NOR) Vz(MAX) m A FP5ZC8V2...