GBJL25KA Overview
Features Thin Single In-Line package; Ideal for printed circuit boards; Glass Passivated chip junction;.
GBJL25KA Key Features
- Thin Single In-Line package
- Ideal for printed circuit boards
- Glass Passivated chip junction
- Low profile package
- High Surge current capability
- High case dielectric strength of 2500 VRMS
- Plastic package has Underwrites Laboratory
- Same footprint V.S GBJ package
- Case: GBJL
- High temperature soldering guaranteed: Solder Dip 270℃,10seconds
GBJL25KA Applications
- 600V to 1000V Forward Current
