GL2508-T2
Key Features
- Glass passivated chip junction
- Thin single in-line package
- Ideal for printed circuit boards
- High surge current capability
- High case dielectric strength of 2500 VRMS
- Low forward voltage drop
- Solder dip 260 °C, 10s
- pliant to RoHS Directive 2002/95/EC and in
- Case: GBJ(5S), molded epoxy body Epoxy meets UL 94V-0 flammability rating
- Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22B-106
