Download GSGP0260SD Datasheet PDF
GSGP0260SD page 2
Page 2
GSGP0260SD page 3
Page 3

GSGP0260SD Key Features

  • Low forward voltage drop
  • Low leakage current
  • Moisture sensitivity: level 1, per J-STD-020
  • Solder dip 260 °C, 10 s
  • Low profile, typical thickness 1.0mm