HS1M
Overview
- Glass passivated junction chip.
- For surface mounted application
- Low forward voltage drop
- Low profile package
- Built-in stain relief, ideal for automatic placement
- Fast switching for high efficiency
- High temperature soldering: 250oC/10 seconds at terminals
- Plastic material used carries Underwriters Laboratory Classification 94V-O Mechanical Data
- Cases: Molded plastic
- Terminals: Solder plated
