HS2F
Features
Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250o C/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-O
Mechanical Data
Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Weight: 0.003 ounce, 0.093 gram
.Data Sheet.co.kr
Maximum Ratings and Electrical Characteristics
Ratings at 25o C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20% Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current See Fig.2 Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous...
