KBJL4KV Overview
Key Features
- Thin single In-line package
- Ideal for printed circuit boards
- Glass passivated chip junction
- Low profile package
- High surge current capability
- High case dielectric strength of 2000 VRMS
- Plastic package has Underwrites Laboratory
- ~ ~ + Mechanical Data
- Epoxy meets UL-94V-0 Flammability rating
- Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102, E3 suffix for customer grade, meet JESD 201
