KBJL6MU Overview
Features Thin Single In-Line package; Ideal for printed circuit boards; Glass Passivated chip junction;.
KBJL6MU Key Features
- Thin Single In-Line package
- Ideal for printed circuit boards
- Glass Passivated chip junction
- Low profile package
- High Surge current capability
- High case dielectric strength of 2000 VRMS
- Plastic package has Underwrites Laboratory
- Same footprint V.S KBJ (3S) package
- 600V to 1000V Forward Current
- 6.0 Amperes
KBJL6MU Applications
- 600V to 1000V Forward Current