MUR840F
Key Features
- FRED (Planar) wafer construction
- Low forward voltage drop, low power losses
- High efficiency operation
- Plastic package has underwriters Laboratory
- Case: Epoxy, Molded
- Weight: 1.9grams(approximately)
- Lead Temperature for Soldering Purposes: 260°C Max. for 10 sec
- Shipped 50 units per plastic tube
