MURB1620CT
Key Features
- FRED (Planar) wafer construction
- Low forward voltage drop, low power loss
- High efficiency
- Plastic package has underwriters Laboratory
- Case: Epoxy, Molded
- Weight: 1.4grams (approximately)
- Finish: all external surfaces corrosion resistant and terminal leads are readily solderable
- Lead temperature for soldering purposes: 260°C max. for 10 sec
- Shipped 50 units per plastic tube or tape reel packing 800/reel
