SGP0230SD Datasheet | Good-Ark Semiconductor

Features - Low forward voltage drop - Low leakage current - Moisture sensitivity: level 1, per J-STD-020 - Solder dip 260 °C, 10 s - Low profile, typical thickness 1.0mm Package: e SGP (SOD‐323F) Applications For use in fast swiching in RF module, lighting, cell phone, portable devices, power supplie and other consumer applications. Maximum Ratings (TA = 25°C unless otherwise noted) Parameter Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current (8.3 ms single half sine-wave superimposed on rated load) Operating Junction Temperature Range Storage Temperature Range Symbol VRRM VRMS VDC IF(AV) IFSM TJ TSTG 30 21 30 - 55 to + 150 - 55 to + 150 SGP0240SD 40 28 40 Unit °C °C Electrical Characteristics (TA = 25°C unless otherwise...