SL25B Datasheet | Good-Ark Semiconductor

FEATURES - Ideal for automated placement - Low forward voltage drop - Low leakage current - Meets environmental standard MIL-S-19500D - Moisture sensitivity:level 1, per J-STD-020 - Solder dip 275 °C, 10s - pliant to Ro HS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC Package: DO-214AA (SMB) APPLICATIONS For use in general purpose rectification of lighting, power supplies, inverters, converters and freewheeling diodes for consumer, automotive and telemunication. PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF TJ max. 2A 20 V to 100 V 45A 0.42V 0.47V 0.72V 125 °C 150°C MECHANICAL DATA Case: DO-214AA, molded epoxy body Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22B-106 Polarity: Laser Band Denotes Cathode Band MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER Maximum repetitive peak reverse voltage Maximum RMS voltage SYMBOL VRRM VRMS SL22B SL23B SL24B SL25B SL26B SL27B SL28B SL29B SL210B 20 30 40 50 60 70 80 90 100 14 21 28 35 42 49 56 63 70 Maximum DC blocking voltage Maximum average forward rectified current at TL (See Fig.1) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Operating junction temperature range Storage temperature range VDC IF(AV) IFSM TJ TSTG 20 30 40 - 55 to + 125 50 60 70 80 2 - 55 to + 150 - 55 to + 150 UNIT A °C...