SL33C
Key Features
- Ideal for automated placement
- Low forward voltage drop
- Low leakage current
- Meets environmental standard MIL-S-19500D
- Moisture sensitivity:level 1, per J-STD-020
- Solder dip 275 °C, 10s
- pliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC
