DGS70 Datasheet | GOOD ELECTRONIC

Features ˙ Fully glass passivated -needs no encapsulation ˙ Peak reverse voltage to 1800 volts ˙ Low forward voltage drop(VF) ˙ Metallized surface Glass AT w Description The GPP chips series are diffused silicon, glass passivated rectifier die. These devices can be supplied to meet customer’s requirements. The prime application for unencapsulated die is in hybrid circuits. For this reason, a variety of metallized surfaces are available. Gold is standard for wire bonding, and for soldering application, gold flash chips are supplied. Electrical Characteristics (TA = 25o C unless specified) PAR AMETER SYMBOL DGS60 UNIT Dimension 60±3 70±3 mils Dimension 45±3 57±3 mils Dimension 265±8 μm Peak Inverse Voltage Forward current Forward Voltage Drop Forward Surge current VB 1100 IF 1.5~2.0 2.0 ≤ 0.98 ≤ 0.98 IFSM Volts Amps Volts Amps Reverse Recovery Time Junction...