LB8S Overview
Device mounted P.C.B with 0.47x0.47''(12mmx12mm) Copper Pads.
LB8S Key Features
- Low Profile: Typical height of 1.4mm
- Ideal for automated placement
- High surge current capability
- Solder Dip 260℃,10seconds
- Case:SOPA-4 Epoxy meets UL-94V-0 Flammability rating
- Terminals:Matte tin plated ldads, solderable per J-STD-002B and JESD22-B102D
- Polarity:As markde on body



