Datasheet Summary
GS8170LW36/72AC-350/333/300/250
209-Bump BGA mercial Temp Industrial Temp Features
- Late Write mode, Pipelined Read mode
- JEDEC-standard SigmaRAM™ pinout and package
- 1.8 V +150/- 100 mV core power supply
- 1.8 V CMOS Interface
- ZQ controlled user-selectable output drive strength
- Dual Cycle Deselect
- Burst Read and Write option
- Fully coherent read and write pipelines
- Echo Clock outputs track data output drivers
- Byte write operation (9-bit bytes)
- 2 user-programmable chip enable inputs
- IEEE 1149.1 JTAG-pliant Serial Boundary Scan
- 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
- Pin-patible with future 36Mb, 72Mb, and 144Mb devices
- Pb-Free 209-bump BGA...