GS832136GE Datasheet | GSI Technology

GS832118/32/36E-250/225/200/166/150/133 165-Bump FP-BGA mercial Temp Industrial Temp 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 250 MHz- 133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Features - IEEE 1149.1 JTAG-patible Boundary Scan - 2.5 V or 3.3 V +10%/- 10% core power supply - 2.5 V or 3.3 V I/O supply - LBO pin for Linear or Interleaved Burst mode - Internal input resistors on mode pins allow floating mode pins - Byte Write (BW) and/or Global Write (GW) operation - Internal self-timed write cycle - Automatic power-down for portable applications - JEDEC-standard 165-bump FP-BGA package - Pb-Free 165-bump BGA package available Functional Description Applications The...