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GS8342D08E-250 - 36Mb SigmaQuad-II Burst

This page provides the datasheet information for the GS8342D08E-250, a member of the GS8342D08E-333 36Mb SigmaQuad-II Burst family.

Description

Table Symbol SA NC R W BW0 BW3 NW0 NW1 K K C C TMS TDI TCK TDO VREF ZQ Qn Dn Doff CQ CQ VDD VDDQ VSS Note: NC = Not Connected to die or any other pin Description Synchronous Address Inputs No Connect Synchronous Read Synchronous Write Synchronous Byte Writes Nybble Write Control Pin

Features

  • Simultaneous Read and Write SigmaQuad™ Interface.
  • JEDEC-standard pinout and package.
  • Dual Double Data Rate interface.
  • Byte Write controls sampled at data-in time.
  • Burst of 4 Read and Write.
  • 1.8 V +100/.
  • 100 mV core power supply.
  • 1.5 V or 1.8 V HSTL Interface.
  • Pipelined read operation.
  • Fully coherent read and write pipelines.
  • ZQ pin for programmable output drive strength.
  • IEEE 1149.1 JTAG-co.

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Datasheet preview – GS8342D08E-250

Datasheet Details

Part number GS8342D08E-250
Manufacturer GSI Technology
File Size 2.39 MB
Description 36Mb SigmaQuad-II Burst
Datasheet download datasheet GS8342D08E-250 Datasheet
Additional preview pages of the GS8342D08E-250 datasheet.

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Full PDF Text Transcription

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Preliminary GS8342D08/09/18/36E-333/300/250/200/167 www.DataSheet4U.com 165-Bump BGA Commercial Temp Industrial Temp Features • Simultaneous Read and Write SigmaQuad™ Interface • JEDEC-standard pinout and package • Dual Double Data Rate interface • Byte Write controls sampled at data-in time • Burst of 4 Read and Write • 1.8 V +100/–100 mV core power supply • 1.5 V or 1.8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ pin for programmable output drive strength • IEEE 1149.1 JTAG-compliant Boundary Scan • 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available • Pin-compatible with present 9Mb and 18Mb and future 72Mb and 144Mb devices 36Mb SigmaQuad-II Burst of 4 SRAM 167 MHz–333 MHz 1.8 V VDD 1.
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