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BL Galaxy Electrical
Production specification
Surface mount zener diode
FEATURES
z Planar die construction. z 500mW power dissipation on ceramic
PCB. z General purpose, medium current.
Pb
Lead-free
z Ideally suited for automated assembly processes.
BZT52C2V0-BZT52C51
APPLICATIONS
z Zener diode. z Ultra-small surface mount package.
SOD-123
ORDERING INFORMATION
Type No. BZT52C2V4-BZT52C51
Marking See table 2
Package Code SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ IF=10mA
Power Dissipation
Thermal resistance,junction to ambient air
VF Pd RθjA
0.9 500 305
V mW ℃/W
Junction temperature
Tj 150
℃
Storage temperature range
Tstg -65-150
℃
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.