GBPC1502T Datasheet | GeneSiC

Features - Integrally molded heat sink provides low thermal resistance for maximum heat dissipation - High surge current capability - Void-free junction soldering by using vacuum soldering - Universal 3-way terminals: snap on, wire-around, or P.C board mounting - High temperature soldering guaranteed: 260⁰C/ 10 seconds at 5 lbs (2.3 kg) tension - Not ESD Sensitive GBPC-T/W Package Mechanical Data Case: Molded plastic with heat sink integrally mounted in the bridge encapsulation Terminals: Either nickel plated 0.25". Faston lugs or copper leads 0.040" diameter. Polarity: Polarrity symbols marked on the body Mounting position: Bolt down on heat-sink with silicone thermal pound between bridge and mounting surface Weight: 15 grams or 0.53 ounces Mounting torque: 20 inch-lbs max Maximum ratings at Tc = 25 °C, unless otherwise specified (GBPCXXXXT uses GBPC-T package while GBPCXXXXW uses GBPC-W package) Parameter Symbol Conditions GBPC15005T/W GBPC1501T/W GBPC1502T/W GBPC1504T/W Unit Repetitive peak reverse voltage RMS reverse voltage DC blocking voltage Operating temperature Storage temperature VRRM VRMS VDC Tj Tstg 50 35 50 -55 to 150 -55 to 150 100 70 100 -55 to 150 -55 to 150 200 140 200 -55 to 150 -55 to 150 400 280 400 -55 to 150 -55 to 150 V V V °C °C Electrical characteristics at Tc = 25 °C, unless otherwise specified Single phase, half sine wave, 60 Hz, resistive or inductive load For capacitive load derate current by 20% Parameter Symbol Conditions GBPC15005T/W GBPC1501T/W GBPC1502T/W GBPC1504T/W Maximum average forward rectified current Peak forward surge current Maximum instantaneous forward voltage drop per leg Maximum DC reverse current at rated DC blocking voltage per leg Rating for fusing RMS isolation voltage from case to leads Typical junction capacitance Typical thermal resistance IO IFSM VF IR I2t VISO Cj RΘJC Tc = 55 °C single sine-wave IF = 7.5...