BYV32-150 Datasheet | General Semiconductor

Features - Dual rectifier construction, positive centertap - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Glass passivated chip junctions - Low power loss - Low forward voltage, high current capability - High surge capability - Superfast recovery time for high efficiency - High temperature soldering guaranteed: 250°C, 0.16" (4.06mm) from case for 10 seconds 0.113 (2.87) 0.103 (2.62) 0.145 (3.68) 0.135 (3.43) 0.560 (14.22) 0.530 (13.46) 0.410 (10.41) 0.390 (9.91) PIN 2 0.635 (16.13) 0.625 (15.87) 1 0.160 (4.06) 0.140 (3.56) 0.560 (14.22) 0.530 (13.46) 3 0.350 (8.89) 0.330 (8.38) 1.148 (29.16) 1.118 (28.40) 0.110 (2.79) 0.100 (2.54) MECHANICAL DATA 0.105 (2.67) 0.095 (2.41) 0.037 (0.94) 0.027 (0.68) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 0.022 (0.56) 0.014 (0.35) PIN 1 PIN 3 PIN 2 CASE Dimensions in inches and (millimeters) Case: JEDEC TO-220AB molded plastic body over passivated chips Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS BYV32-50 BYV32-100 BYV32-200 UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=120°C Peak forward surge current 10ms single half sine-wave superimposed at at TJ=150°C Maximum instantaneous forward voltage per leg at: IF=20A IF=5.0A, TJ=100°C Maximum DC reverse current at rated DC blocking voltage TC=25°C TC=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 18.0 150 105 150 200 140 200 Volts Volts Volts Amps IFSM Amps 1.15 0.85 10.0 600.0 25.0 45.0 20.0 3.0 -65 to +150 Volts µA ns p F °C/W °C IR trr CJ RΘJA RΘJC TJ, TSTG Maximum reverse recovery time per leg (NOTE 1) Typical junction capacitance per leg (NOTE 2) Maximum thermal resistance per leg (NOTE 3)...