BYVB32-200 Datasheet | General Semiconductor

Features - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Dual rectifier construction, positive centertap - Glass passivated chip junctions - Low power loss - Low forward voltage, high current capability - High surge capability - Superfast recovery time for high efficiency - High temperature soldering in accordance with CECC 802 / Reflow guaranteed 0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88) SEATING PLATE -T- 0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79) 0.095 (2.41) 0.100 (2.54) MECHANICAL DATA Case: JEDEC TO-263AB molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams PIN 1 K - HEATSINK PIN 2 Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS BYVB32-50 BYVB32-100 BYVB32-150 UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=120°C Peak forward surge current 10ms single half sine-wave superimposed at at TJ=150°C Maximum instantaneous forward voltage per leg at: IF=20A, IF=5.0A, TJ=100°C Maximum DC reverse current at rated DC blocking voltage Typical junction capacitance (NOTE 2) Maximum thermal resistance per leg (NOTE 3) Operating and storage temperature range TJ=25°C TJ=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 18.0 150 105 150 200 140 200 Volts Volts Volts Amps IFSM Amps 1.15 0.85 10.0 600.0 35.0 45.0 3.0 -65 to +150 Volts µA ns p F °C/W °C IR trr CJ RΘJC TJ,...