BYW34 Datasheet | General Semiconductor

Features DO-204AP 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 0.150 (3.8) 0.100 (2.5) DIA. - High temperature metallurgically bonded construction - Hermetically sealed case - Glass passivated cavity-free junction - 2.0 Ampere operation at TA=55°C with no thermal runaway - Typical IR less than 0.1µA - Capable of meeting environmental standards of MIL-STD-19500 - Fast switching for high efficiency - High temperature soldering guaranteed: 350°C/10 seconds 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension 1.0 (25.4) MIN. MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 grams Dimensions in inches and (millimeters) - Brazed-lead assembly is covered by Patent No. 3,930,306 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS BYW32 BYW33 BYW35 BYW36 UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=55°C Peak forward surge current 10ms single half sine-wave superimposed on rated load at TA=25°C Maximum instantaneous forward voltage at 2.0A Maximum DC reverse current at rated DC blocking voltage Maximum full load reverse current Full cycle average, 0.375” (9.5mm) lead length Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction temperature range Storage temperature range TA=25°C TA=100°C VRRM VRMS VDC I(AV) 200 140 200 300 210...