BYW72 Datasheet | General Semiconductor

Features Case Style G3 1.0 (25.4) MIN 0.250 (6.3) 0.170 (4.3) DIA. 0.300 (7.6) MAX. - High temperature metallurgically bonded construction - Glass passivated cavity-free junction - Hermetically sealed package - 3.0 ampere operation at TA=45°C with no thermal runaway - Typical IR less than 0.1µA - Capable of meeting environmental standards of MIL-S-19500 - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension 0.052 (1.32) 0.048 (1.22) DIA. 1.0 (25.4) MIN MECHANICAL DATA Case: Solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 ounce, 1.1grams Dimensions in inches and (millimeters) - Brazed-lead assembly is covered by Patent No. 3,930,306 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS BYW73 BYW74 BYW75 BYW76 UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=45°C Peak forward surge current 10ms single half sine-wave superimposed on rated load at TJ=150°C Maximum instantaneous forward voltage at 3.0A Maximum average reverse current at rated peak reverse voltage at TA=100°C Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction temperature range Storage temperature range VRRM VRMS VDC I(AV) 200 140 200 300 210 300 400 280 400 3.0 500 350...