FE1C Datasheet | General Semiconductor

Key Features

• High temperature metallurgically bonded construction
• Glass passivated cavity-free junction
• Superfast recovery time for high efficiency
• Low forward voltage, high current capability
• Capable of meeting environmental standards of MIL-S-19500
• Hermetically sealed package
• Low leakage current
• High surge current capability
• High temperature soldering guaranteed: 350°C/10 seconds, 0.375” (9.5mm) lead length, 5 lbs. (2.3kg) tension E P A T E N T DO-204AP
• 034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN.