FE5D Datasheet | General Semiconductor

FEATURES - High temperature metallurgically bonded construction - Glass passivated cavity-free junction - Super fast recovery time for high efficiency - Low forward voltage, high current capability - Capable of meeting environmental standards of MIL-S-19500 - Hermetically sealed package - Low leakage current - High surge current capability - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension Case Style G4 0.180 (4.6) 0.115 (2.9) DIA. 1.0 (25.4) MIN. 0.300 (7.6) MAX. 0.042 (1.07) 0.038 (0.962) DIA. 1.0 (25.4) MIN. MECHANICAL DATA Dimensions in inches and (millimeters) - Brazed-lead assembly is covered by Patent No. 3,930,306 Case: Solid glass body Terminals: Axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.037 ounce, 1.04 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS . Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS FE5A FE5B FE5C UNITS Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=55°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 5.0A Maximum DC reverse current at rated DC blocking voltage Maximum reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3, 4) Operating junction and storage temperature range TA=25°C TA=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 150 105 150 5.0 200 140 200 Volts Volts Volts Amps IFSM VF IR trr CJ RΘJA RΘJL TJ, TSTG 135.0 0.95 5.0 50.0 35.0 100.0 55.0 20.0 -65 to +175 Amps Volts µA ns p F °C/W °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 VDC (3) Thermal resistance from junction to...