FESB16HT
FEATURES
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- Glass passivated chip junction
- Low power loss
- Low forward voltage, high current capability
- High surge current capability
- Superfast recovery time, for high efficiency
- High temperature soldering in accordance with CECC 802 / Reflow guaranteed
0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88)
SEATING PLATE
-T-
0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79)
0.095 (2.41) 0.100 (2.54)
MECHANICAL DATA
Case: JEDEC TO-263AB molded plastic body over passivated chips Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams
PIN 1 K
- HEATSINK PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
FESB SYMBOLS 16AT
FESB 16BT
FESB 16CT
FESB...
