FESB8HT Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Glass passivated chip junction - Low leakage, high voltage - High surge current capability - Superfast recovery time, for high efficiency - High temperature soldering in accordance with CECC 802 / Reflow guaranteed 0.380 (9.65) 0.420 (10.67) 0.245 (6.22) MIN K 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.320 (8.13) 0.360 (9.14) 1 K 2 0.575 (14.60) 0.625 (15.88) 0.047 (1.19) 0.055 (1.40) SEATING PLATE -T- 0.090 (2.29) 0.110 (2.79) 0.018 (0.46) 0.025 (0.64) 0.027 (0.686) 0.037 (0.940) 0.080 (2.03) 0.110 (2.79) MECHANICAL DATA Case: JEDEC TO-263AB molded plastic body Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.08 ounce, 2.24 grams 0.095 (2.41) 0.100 (2.54) PIN 1 K - HEATSINK PIN 2 Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS FESB 8AT FESB 8BT FESB 8CT FESB 8DT FESB 8FT FESB 8GT FESB 8HT FESB 8JT UNITS Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current at rated DC blocking voltage at TC=25°C TC=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 150 105 150 200 140 200 8.0 300 210 300 400 280 400 500 350...