FESF8DT Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Glass passivated chip junction - Low leakage, high voltage - High surge current capability - Superfast recovery time, for high efficiency - High temperature soldering guaranteed: 250°C, 0.25" (6.35mm) from case for 10 seconds 0.405 (10.27) 0.383 (9.72) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.140 (3.56) DIA. 0.130 (3.30) 0.131 (3.39) DIA. 0.122 (3.08) 0.600 (15.5) 0.580 (14.5) 0.670 (17.2) 0.646 (16.4) 0.350 (8.89) 0.330 (8.38) PIN 1 0.191 (4.85) 0.171 (4.35) 0.560 (14.22) 0.530 (13.46) 0.060 (1.52) 0.110 (2.80) 0.100 (2.54) MECHANICAL DATA Case: JEDEC ITO-220AC fully overmolded plastic body over passivated chip Terminals: Plated lead solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting Position: Any Weight: 0.064 ounce, 1.81 grams Mounting Torque: 5 in. - lbs. max. 0.037 (0.94) 0.027 (0.69) 0.205 (5.20) 0.195 (4.95) PIN 1 PIN 2 0.022 (0.55) 0.014 (0.36) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS FESF 8AT FESF 8BT FESF 8CT FESF 8DT FESF 8FT FESF 8GT FESF 8HT FESF 8JT UNITS Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TC=100°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current at rated DC blocking voltage TC=25°C at TC=100°C VRRM VRMS VDC I(AV) 50 35 50 100 70 100 150 105 150 200 140 200 8.0 300 210 300 400 280...