GP02-25 Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - High temperature metallurgically bonded construction - Glass passivated cavity-free junctions - Capable of meeting environmental standards of MIL-S-19500 - High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension - P A T 1.0 (25.4) MIN. 0.107 (2.7) 0.080 (2.0) DIA. 0.205 (5.2) 0.160 (4.1) 1.0 (25.4) MIN. 0.034 (0.86) 0.028 (0.71) DIA. MECHANICAL DATA Case: JEDEC DO-204AL molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.012 ounce, 0.3 gram - Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306 ® Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS GP02 -20 GP02 -25 GP02 -30 GP02 -35 GP02 -40 UNITS Maximum repetitive peak reverse voltage Maximum RMS Voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load at: (JEDEC Method) TA=55°C Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current at rated DC blocking voltage Typical reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range TA= 25°C TA=100°C VRRM VRMS VDC I(AV) 2000 1400 2000 2500 1750 2500 3000 2100 3000 0.25 3500 2450 3500 4000 2800 4000 Volts Volts Volts Amp IFSM VF IR trr CJ RΘJA TJ, TSTG 15.0 3.0 5.0 50.0 2.0 3.0 130.0 -65 to...