General Semiconductor GP08G
GP02
| Part No. | GP08G |
|---|---|
| Datasheet | GP08G Download |
| Manufacturer |  General Semiconductor |
| Description | GP02 |
| Buy | Stock & Price |
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ 0.8 Ampere operation at TA=55°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension T E D P A T E N 1.0 (25.4) MIN. 0.107 (2.7) 0.080 (2.0) DIA. 0.205 (5.2) 0.160 (4.1) 1.0 (25.4) MIN. 0.034 (0.86) 0.028 (0.71) DIA. NOTE: Lead diameter is 0.026 (0.66) 0.023 (0.58) for suffix "E" part numbersMECHANICAL DATA
Case: JEDEC DO-204AL molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.012 ounce, 0.3 gram Dimensions in inches and (millimeters) Glass-plastic encapsulation technique is covered by Patent No.3,996,602 and br...