GP08J
GP08J is GP02 manufactured by General Semiconductor.
Features
- Plastic package has Underwriters Laboratory Flammability Classification 94V-0
- High temperature metallurgically bonded construction
- Glass passivated cavity-free junction
- Capable of meeting environmental standards of MIL-S-19500
- 0.8 Ampere operation at TA=55°C with no thermal runaway
- Typical IR less than 0.1µA
- High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
1.0 (25.4) MIN. 0.107 (2.7) 0.080 (2.0) DIA.
0.205 (5.2) 0.160 (4.1)
1.0 (25.4) MIN. 0.034 (0.86) 0.028 (0.71) DIA.
NOTE: Lead diameter is 0.026 (0.66)
0.023 (0.58) for suffix "E" part numbers
MECHANICAL DATA
Case: JEDEC DO-204AL molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.012 ounce, 0.3 gram
Dimensions in inches and (millimeters) Glass-plastic encapsulation technique is covered by Patent No.3,996,602 and brazed-lead assembly by Patent No.3,930,306
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MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
GP08A
GP08B
GP08D
GP08G
UNITS
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375" (9.5mm) lead length at TA =55°C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) at TA=55°C Maximum instantaneous forward voltage at 0.8A Maximum full load reverse current full cycle average 0.375" (9.5mm) lead length at TA=55°C Maximum DC reverse current at rated DC blocking voltage Typical reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range TA=25°C TA=125°C
VRRM VRMS VDC I(AV)
50 35 50
100 70 100
200 140 200 0...
