SM5A27
FEATURES
¨ Ideally suited for load dump protection ¨ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ¨ High temperature stability due to unique oxide passivation ¨ Exclusive patented PARª oxide passivated chip construction ¨ Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation ¨ Low leakage current at TJ=175¡C ¨ Low forward voltage drop ¨ High temperature soldering guaranteed: 260¡C for 10 seconds at terminals
T PA
0.116(3.0) 0.093(2.4)
0.413(10.5) 0.342(8.7) 0.374(9.5) 0.327(8.3)
0.366(9.3) 0.343(8.7) 0.406(10.3) 0.382(9.7)
LEAD 1 0.197(5.0) 0.185(4.7) 0.028(0.7) 0.020(0.5) 0.098(2.5) 0.059(1.5)
0.138(3.5) 0.098(2.5)
MECHANICAL DATA
Case: Molded plastic body, surface mount with heatsink integrally mounted in the encapsulation Terminals: Plated, solderable per MIL-STD-750, Method 2026 Polarity: Heatsink is anode Mounting Position: Any Weight: 0.091 ounce, 2.58 grams
0.028(0.7) 0.012(0.3) LEAD...
