SS33 Datasheet | General Semiconductor

FEATURES - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - For surface mount applications - Low profile package - Built-in strain relief, ideal for automated placement - Easy pick and place - Metal silicon junction, majority carrier conduction - Low power loss, high efficiency - High current capability, low forward voltage drop - For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications - High temperature soldering: 250°C/10 seconds at terminals 0.126 (3.20) 0.114 (2.90) 0.245 (6.22) 0.220 (5.59) 0.280 (7.11) 0.260 (6.60) 0.012 (0.305) 0.006 (0.152) 0.103 (2.62) 0.079 (2.06) 0.060 (1.52) 0.030 (0.76) 0.320 (8.13) 0.305 (7.75) 0.008 (0.203) MAX. MECHANICAL DATA Case: JEDEC DO-214AB molded plastic body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.007 ounce 0.25 gram Dimensions in inches and (millimeters) .. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS SYMBOLS SS32 SS33 SS34 SS35 SS36 UNITS Ratings at 25°C ambient temperature unless otherwise specified. Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL (SEE FIG. 1) (NOTE 2) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 3.0A (NOTE 1) S2 VRRM VRMS VDC I(AV) IFSM 20 14 20 S3 30 21 30 S4 40 28 40 3.0 100.0 S5 50 35 50 S6 60 42 60 Volts Volts Volts Amps Amps VF IR RΘJA RΘJL TJ TSTG 0.50 0.5 20.0 55.0 17.0 -55 to +125 -55 to +150 0.75 10.0 Volts m A °C/W Maximum DC reverse current (NOTE 1) TA=25°C at rated DC blocking voltage TA=100°C Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range NOTES: (1) Pulse test: 300µs pulse width, 1% duty cycle (2) P.C.B. mounted 0.55 x 0.55” (14 x 14mm) copper pad areas -55 to...