TGL41-7.5 Datasheet | General Semiconductor

FEATURES DO-213AB SOLDERABLE ENDS 1st BAND D2 D1= 0.105 0.095 (2.67) (2.41) 0.022 (0.56) 0.018 (0.46) 0.205 (5.2) 0.185(4.7) 1st band denotes type and positive end (cathode) 0 D2 = D1 + - 0.008 (0.20) - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - For surface mounted applications - Glass passivated junction - Excellent clamping capability - Low incremental surge resistance - Fast response time typically less than 1.0ps from 0 Volts to V(BR) - 400W peak pulse capability with a 10/1000µs waveform, repetition rate (duty cycle): 0.01% - For devices with V(BR)≥10V, ID are typically less than 1.0µA - High temperature soldering guaranteed: 250°C/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-213AB molded plastic body over passivated junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Blue bands denotes the cathode which is positive with respect to the anode under normal TVS operation Mounting Position: Any Weight: 0.116 gram, 0.0046 ounce Dimensions in inches and (millimeters) Available in uni-directional only MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. RATINGS SYMBOL VALUE UNITS Peak pulse power dissipation with a 10/1000µs waveform (NOTE 1, FIG. 1) Steady state power dissipation at TL=75°C (NOTE 2) Peak pulse current with a 10/1000µs waveform (NOTE 1, FIG. 3) PPPM PM(AV) IPPM Minimum 400 1.0 SEE TABLE 1 Watts Watt Amps Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load for unidirectional only (JEDEC Method) (NOTE 3) Maximum instantaneous forward voltage at 25A for unidirectional only Operating junction and storage temperature range IFSM Amps VF TJ, TSTG 3.5 -55 to +150 Volts °C NOTES: (1) Non-repetitive current pulse, per Fig. 3 and derated above TA=25°C per Fig. 2 (2) Mounted on copper pads to each terminal of 0.31 in (8.0 mm ) per Fig. 5 (3) Measured at 8.3ms single...