TPSMC30 Datasheet | General Semiconductor

FEATURES DO-214AB Modified J-Bend 0.126 (3.20) 0.114 (2.90) 0.245 (6.22) 0.220 (5.59) 0.280 (7.11) 0.260 (6.60) 0.012 (0.305) 0.006 (0.152) 0.103 (2.62) 0.079 (2.06) 0.060 (1.52) 0.030 (0.76) 0.320 (8.13) 0.305 (7.75) 0.008 (0.203) MAX. - Designed for under the hood surface mount applications - Plastic package has Underwriters Laboratory Flammability Classification 94V-0 - Easy pick and place - Low profile package - Built-in strain relief - Ideal for automated placement - Exclusive patented PAR™ oxide passivated chip construction - 1500W peak pulse power capability with a 10/1000µs waveform, repetition rate (duty cycle): 0.01% - Excellent clamping capability - Low incremental surge resistance - Fast response time: typically less than 1.0ps from 0 Volts to V(BR) - For devices with V(BR)≥10V ID are typically less than 1.0µA at TA=150°C - High temperature soldering: 250°C/10 seconds at terminals PA TE MECHANICAL DATA Case: JEDEC DO-214AB molded plastic body over passivated junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes positive end (cathode) Mounting Position: Any Weight: 0.007 ounces, 0.2 gram Dimensions in inches and (millimeters) Available in uni-directional only MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS VALUE UNITS Peak pulse power dissipation with a 10/1000µs waveform (NOTES 1, 2, FIG. 3) Peak power pulse current with a 10/1000µs waveform (NOTE 1, FIG. 1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) (NOTES 2, 3) Maximum instantaneous forward voltage at 100A (NOTE 3) Operating junction and storage temperature range PPPM IPPM Minimum 1500 SEE TABLE 1 Watts Amps IFSM VF TJ,...