DG2 Datasheet PDF

FEATURES

P A T E N T DO-204AP 0.034 (0.86) 0.028 (0.71) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 0.150 (3.8) 0.100 (2.5) DIA. ♦ Specially designed for clamping circuits in horizontal deflection systems and damper applications ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ 2.0 Ampere operation at TA=50°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ Hermetically sealed package ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension E 1.0 (25.4) MIN.

MECHANICAL DATA

Case: JEDEC DO-204AP solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 grams Dimensions in inches and (millimeters) *Braised-lead assembly is covered by Patent No. 3,930,306

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.