GSESMAJ Description
Peak Pulse Power Dissipation:.
GSESMAJ Key Features
- For surface mounted application in order to optimize board space
- Low profile package
- Built-in strain relief
- Glass passivated junction
- Low inductance
- Excellent clamping capability
- Fast response time: typically less than 1.0ps from
- Typical IR less than 1μA above 10V
- Case: Molded plastic, SMA Package
- Epoxy: UL 94V-0 rate flame retardant