Good-Ark Semiconductor BY299
FAST RECOVERY SILICON RECTIFIER
FEATURES
Fast recovery diodes Diffused junction High current capability The plastic material carries U/L recognition 94V-0 Terminals: Axial leads Polarity: Color band denotes cathode Mounting Instruction Min. distance from body to soldering point, 4mm Max. solder temperature, 350 Max. soldering time: 3.5 Sec. Do not bend lead at a point closer than 3mm to the body DIM ENSIONS DIM A B C D inches Min. 0.283 0.189 0.048 1.000 Max. 0.374 0.208 0.051 Min. 7.20 4.80 1.20 25.40 mm Max. 9.50 5.30 1.30 NoteMAXIMUM RATINGS
andELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified. Symbols BY296 BY297 BY298 BY299 BY299S Units Peak repetitive and non recurrent reverse voltage Forward current, R load at Tamb=50 8.3mS peak forward surge current at Tj=25 Recurrent peak forward current (A) Maximum forward voltage drop at IF=2.0A Maximum reverse current at VRRM at 25 Maximum reverse recovery time (Note 1) Maximum thermal resistance (I=10mm) Operating and storage temperature range Note: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A VRRM I(AV) IFSM IFRM VF IR T rr R JA 100 200 400 2.0 70.0 10.0 1.