Good-Ark Semiconductor S0603F1.75
Fast Acting Chip Fuse
DESCRIPTION
● Fast acting for excessive current● Compatible with reflow and wave solder
● Rugged ceramic and glass construction
● Excellent environmental performance
● RoHS Compliant, Lead Free & Halogen Free material
APPLICATIONS
● Telecommunication: PDA / DSL/ Cell Phones● Computers: LCD Panels / Printers/ Laptops/ Servers
● Consumer Electronics: DVD players/ MP3 and MP4 Players Sn PLATING CERAMIC SUBSTRATE OVERCOAT FUSE ELEMENT Ag / Ni PLATING Case: 0603 Environmental Data
● Life Test: MIL-STD-202, Method 108A
● Humidity Bias: MIL-STD-202, Method 103
● Moisture Resistance Test: MIL-STD-202, Method 106G
● Thermal Shock: MIL-STD-202, Method 107G
● Terminal Strength: AEC-Q200-006
● Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)
● Vibration: MIL-STD-202, Method 204D
● Mechanical Shock: MIL-STD-202, Method 213B
● Solderability: MIL-STD-202 Method 208H
● Resistance to Solder Heat: MIL-STD-202, Method 210A
ELECTRICAL CHARACTERISTICS
Ampere Rating 250mA-6A 250mA-6A % of Amp Rating 10...