MASF2B
Features
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- Glass passivated chip junctions Ideal for automated placement Ultrafast reverse recovery time for high efficiency Low profile package High forward surge capability High temperature soldering： 260℃/10 seconds at terminals ponent in accordance to Ro HS 2002/95/1 and WEEE 2002/96/EC
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Major Ratings and Characteristics Mechanical Date
- IF(AV) VRRM IFSM trr VF Tj max.
2.0 A 50 V to 600 V 50 A 35 n S 0.95 V, 1.25 V, 1.7 V 150 °C
Case: JEDEC MSMA molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D y Laser band denotes cathode end Polarity:
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Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Items Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Thermal resistance from junction to lead(1)
Symbol VRRM VRMS...
