MASK32
Features
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- Low profile package Ideal for automated placement Ultrafast reverse recovery time Low power losses, high efficiency Low forward voltage drop High surge capability High temperature soldering： 260℃/10 seconds at terminals ponent in accordance to Ro HS 2002/95/1 and WEEE 2002/96/EC
- Mechanical Date
- Major Ratings and Characteristics
IF(AV) VRRM IFSM VF Tj max. 3.0 A 20 V to 100 V 75 A 0.50V,0.55V,0.70V,0.85V 125 °C
Case: JEDEC MSMA molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarity: Laser band denotes cathode end
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Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Items Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Voltage rate of change (rated VR) Thermal resistance from junction to...
