BY268GP Datasheet | Gulf Semiconductor

FEATURE High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C/10sec/0.375”lead length at 5 lbs tension Operate at Ta =55°C with no thermal run away Typical Ir<0.2µA DO-41DO-204AL MECHANICAL DATA Terminal: Plated axial leads solderable per MIL-STD 202E, method 208C Case: Molded with UL-94 Class V-0 recognized Flame Retardant Epoxy Polarity: color band denotes cathode Mounting position: any Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated) SYMBOL Vrrm Vrms Vdc VRSM If(av) Ifsm Vf Ir(av) Ir Trr at ERSM Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC blocking Voltage Non-Repetitive Peak Reverse Voltage Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°C Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load Maximum Forward Voltage at 0.4A and 25°C Maximum full load reverse current full cycle Average at 55°C Ambient Maximum DC Reverse Current Ta =25°C at rated DC blocking voltage Ta =150°C Maximum Reverse Recovery Time (Note 1) Non Repetitive IBR(R)=0.4A Reverse Avalanche Energy BY268GP 1400 980 1400 1600 0.8 20.0 1.25 100 5.0 100.0 400 10 5.0 65.0 -65 to +175 BY269GP 1600 1120 1600 1800 units V V V V A A V µA µA µA n S m J p F Typical Junction Capacitance (Note 2) Typical Thermal Resistance (Note 3) Storage and Operating Junction Temperature Note: Cj Rth(ja) Tstg, Tj °C /W °C 1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A 2. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc 3. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted Rev.A1 .gulfsemi. .. RATINGS AND CHARACTERISTIC CURVES BY268GP THRU BY269GP Rev.A1 .gulfsemi....