SS1Q Datasheet | Gulf Semiconductor

FEATURE For surface mounted application High temperature metallurgic ally bonded Sintered glass junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 450℃/10sec/at terminal／plete device Submersible temperature of 265℃ for 10sec GF1/ DO-214BA MECHANICAL DATA Terminal：Plated Terminal, solderable per MIL-STD 202, method 208C Case：Molded with UL-94 class V-0 recognized Flame Retardant Epoxy over Glass Polarity：color band denotes cathode end Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (single- phase, half - wave, 60HZ, resistive or inductive load rating at 25℃, unless otherwise stated, for capacitive load, derate current by 20％) SYMBOL Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load Maximum Forward Voltage at rated Forward current Ta =25℃ Maximum full load reverse current full cycle average at 75℃ ambient Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ Typical Junction Capacitance (Note 1) Vrrm Vrms Vdc If(av) Ifsm Vf Ir(av) Ir Cj 1200 840 1200 1.0 30.0 5.0 50.0 15.0 Typical Thermal Resistance (Note 2) R(ja) Operating and Storage Temperature Range Tst, Tj -65 to...